Small-quantity Production : DigInfo

588 views · Published 22 June 2007 · 0:55 · Indexed 20 September 2026

Channel: ikinamo · 2007 · Science & Technology

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DigInfo: http://movie.diginfo.tv - Die bonding systems the high mix low volume productions are diversifying. A new microchip assembly system  from precise gauges supports the mounting of chips in various sizes on small modules at low cost. The system enables production in quantities as low as tens of thousands of units per month. Compared to conventional die bonders which assemble fix size chips, the new system can mount chips ranging in size from 100 microns which is one tenth of a millimeter on small modules at a precision of less than one micron. Another feature is that the system not only doubles bonding productivity but requires no changing of type of chip.

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