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Anodic Glass Bonding for MEMS Applications: DigInfo

4,066 views · Published 3 August 2007 · 1:11 · Indexed 2 October 2026

Channel: ikinamo · 2007 · Science & Technology

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DigInfo - http://movie.diginfo.tv

Anodic bonded glass allows for strong and smooth
bonding of glass and silicon under the temperature of 400 degrees
Celsius. 
Selecting the aluminosilicate structured type of glass
enabled thermal expansion bonding onto the silicon
monocrystal under a wide range of temperatures. 
Since this type of thermal expansion bonding allows for
even spaces and hence durability, etching is done on a
specular surface using low-concentrated hydrofluoric acid.
The anodic bonded glass is used for substrates for speed
sensors and pressure sensors, as a component for nozzles
for ink jet printers and as bonded glass for micro
machining purposes.

"It is potentially useful in the MEMS field as it is highly durable and has high added value."

The thermal expansion process can also be changed to suit 
customer's needs. Further development of materials for
low temperature anodic glass bonding are currently
underway.

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